LUMIK

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Main Features
  • Optomechanical technology combining silicon photonics and and high-performance MEMS (Micro Electro-Mechanical Sensors) for motion detection using light.
  • Principle based on the interaction between a MEMS resonator and an optical cavity – the movement of a mass generates an intensity variation that allows it to be measured.
  • Increased sensitivity, higher speed, and optimized integration compared to traditional capacitive and piezoresistive technologies.
Process Characteristics
  • Combination of VLSI (Very Large Scale Integration) optical and mechanical processes
  • 200mm wafer size – Grenoble facility (France)
  • SOI substrate
  • Optical IO patterned by DUV (Deep Ultra-Violet) lithography and formed by dry etching
  • MEMS resonator, photonic devices and electrical contacts defined using e-beam lithography and formed by RIE (Reactive Ion Etching)
  • 1 AlSi metallization level for polarization and interconnections
  • Resonator release by isotropic HF etching
Device Characteristics and key figures
  • Minimum feature size of 100nm for both optical & mechanical parts
  • Operating optical wavelength of 1550 nm
  • Femtometer detection capabilities
  • Response rate in the terahertz range
  • Scalability of VLSI MEMS and silicon-photonics technologies

Prices

The details about the prices will come soon.

 

Contact

 


Optomechanical Technology

Design-Kit Content
  • Standard cells of basic devices to start a design and illustrate the use of CAD layers
  • The standard cell libraries will be gradually extended with each new release of the design kit
CAD Tools
Cadence
  • IC (design framework)
Siemens
  • Calibre (physical verification)
Usual Application areas
  • Portable in-situ mass spectrometry (extreme sensistvity down to viruses and proteins)
  • Portable biological sensing (rapidbiomarker detection and sensitvity down to bacteria)
  • Real-time atomic-force microscopy (video-rate imaging to observe fast biological process)
  • Silicon clocks (quartz-like accuracy for GHz frequency)
  • Inertial sensors (precision and compactness)
  • Quantum information transfer
  • Rheology
Run Dates
  • First submission deadline to CIME-P in February 2026 for first run
  • More details to come in the near future
Turnaround Time
  • 44 weeks for manufacturing