CIME-P: New MPW Service for IC and integrated devices prototyping
CIME-P provides Multi-Project Wafer (MPW) services in ICs, Si-Photonics, 3D-ICs, MEMS and NVM for prototyping for R&D projects. CIME-P enables prototypes fabrication on industrial processes at very attractive costs and offers its technical expertise in providing MPW and related prototyping services for Universities, Research Laboratories and Industrial Companies.
CIME-P can handle, in cooperation with the semiconductor foundries, low volume production i.e. approximately from some dozens to some thousands pieces. CIME-P can also provide circuit packaging service upon request. Advanced chips fabrication technologies are made available in CMOS, SiGe BiCMOS, HV-CMOS, SOI, MEMS, 3D-IC, Si-Photonics, NVM, etc.
CIME-P distributes the design rules for each technology and the standard cell libraries for each specific software tool (design kits) free of charge and supports several CAD software tools for both Industrial Companies and Universities.
CIME-P prototyping service is part of the CIME Nanotech, the microelectronics department of Grenoble INP, the engineering and managment institute of Universtité Grenoble Alpes.